Clients & Partners
Consumer Electronics Consulting
Aremac Labs is India's specialist consulting firm for failure analysis, reliability engineering, and root cause investigation across consumer electronics.
What We Do
We investigate failures at every level of the electronics stack, from the silicon up to the full system, and deliver actionable findings, not just data.
From solder joint fatigue to delamination and contamination, we diagnose board level failures with precision microscopy and cross sectioning.
Lithium ion failures, thermal runaway root causes, swelling, and cycle life degradation, investigated with electrochemical and physical analysis.
LCD, OLED and touch panel defect analysis covering dead pixels, delamination, backlighting failures, and bond line issues, traced to root cause.
Integrated circuit failures from EOS/ESD events, latch-up, die cracking, or bond wire failures, decapsulated and traced systematically.
Proactive reliability testing through HALT, HASS, and environmental stress screening to surface weaknesses before products reach customers.
Characterisation of metals, alloys, coatings, and polymers to understand degradation, corrosion, fracture surfaces, and material composition in failed components.
The Expertise Behind Aremac
"Most failures leave a clear signature — if you know where to look and what to ask."
— Rajasekaran Ganeshkumar, Ph.D. · Founder, Aremac Labs · LinkedIn ↗
Aremac Labs was founded by a specialist with over 8 years of deep experience in electronics failure analysis, having worked at a large international consulting firm with engagements across consumer electronics brands in the US and Asia. The practice brings a rigorous, structured methodology to every investigation, combining materials science, electrical engineering, and hands-on case experience.
How We Work
We review your failure symptoms, sample history, and field data to define the scope and hypothesis space before any analysis begins.
X-ray imaging, optical inspection, and electrical characterization carried out first, preserving evidence before any destructive steps are taken.
SEM, EDX, FIB cross section, or electrochemical analysis matched to the failure type. Systematic, structured, and thoroughly documented.
A clear, evidence-backed report identifying root cause and contributing factors, with specific corrective and preventive action recommendations.
Industries Served
India's climate creates unique failure modes, including accelerated corrosion on PCBA and electrolyte migration in connectors, that standard global test protocols often miss. Our analysis accounts for local use conditions.
Brands that bring us in at the NPI stage, before mass production, consistently reduce warranty return rates. Field failure analysis is reactive. Reliability review at the design stage is preventive.
Actual failure patterns from the field often reveal use-case stresses that no lab test anticipated. A structured field-return analysis program is one of the highest-ROI activities a quality team can run.
Tell us about the symptom. We'll tell you what's actually happening.
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